TW_汽車電子封裝_Packaging Development Engineer (ASIC)
BoschMidHybridFull-time
- Posted
- 24 Aug 2026
- Location
- Taipei, Taiwan
- Role
- Hardware / Embedded
- Experience
- 3+ years
- Salary
- Not listed in the job ad
The full description is on Bosch's site.
The full description is on Bosch's site.