Advanced Packaging TD Plating Module Engineer
IntelMidFull-time
- Posted
- 8 Oct 2026
- Location
- US, Oregon, Hillsboro
- Role
- Other engineering
- Experience
- 2+ years
- Degree
- Master's
- Salary
- $133,800 – $255,200 / year, before tax
The full description is on Intel's site.